宇部Polyimide film Upilex®-S

 
           聚酰亚胺薄膜(Polyimide Film)是世界上性能好的薄膜类绝缘材料,由均苯四甲酸二酐(PMDA)和二胺基二苯醚(DDE)在强极性溶剂中经缩聚并流延成膜再经亚胺化而成。聚酰亚胺薄膜具有优良的耐高低温性、电气绝缘性、粘结性、耐辐射性、耐介质性,能在-269℃~280℃的温度范围内长期使用,短时可达到400℃的高温。

        被称为“黄金薄膜”的聚酰亚胺薄膜具有卓越的性能,它广泛的应用于空间技术、F、H级电机、电器的绝缘、FPC(柔性印刷线路板)、TAB(压敏胶带基材)、航天、航空、计算机、电磁线、变压器、音响、手机、电脑、冶炼、采矿电子元器件工业、汽车、交通运输、原子能工业等电子电器行业。
 
Polyimide film

Upilex®-S

* Upilex is a registered trademark in Japan and other countries of sale.

1. Mechanical Properties

Upilex®-S delivers outstanding mechanical characteristics across a wide temperature range. It also demonstrates high tensile strength and modulus, and even features outstanding long-term heat resistance. Another exceptional feature of Upilex®-S is its high resistance to hydrolysis, as demonstrated by its properties being virtually unaffected even when it is immersed in boiling water for long periods of time.

PropertyUnitCharacteristic valueTest method
Upilex®-25SUpilex®-75S
-269°C-196°C25°C300°C25°C200°C
Tensile strength MPa 735 647 520 290 360 270 ASTM D882
Stress at 5%
elongation
MPa - - 260 90 210 110 ASTM D882
Elongation % 10 15 42 67 50 80 ASTM D882
Tensile modulus MPa - - 9,100 3,700 6,900 3,800 ASTM D882
Tear
strength-initiation
[Graves]
N - - 230 - 290 - ASTM D1004
Tear
strength-propagation
[Elmendorf]
N - - 3.2 - 4.2 - ASTM D1922
Folding
endurance [MIT]
Cycles - - >100,000 - >25,000 - ASTM D2176
Density ×103kg/ m3 - - 1.47 - 1.47 - ASTM D1505
Coefficient of
kinetic friction
(film-to-film)
- - - 0.4 - 0.4 - ASTM D1894

2. Electrical Properties

Upilex®-S exhibits excellent electrical characteristics over a wide range of temperatures and frequencies. Even at high temperatures, Upilex®-S shows almost no deterioration in its electrical properties, unlike other plastic-type films. It also displays a low level of electrical insulation defects, making it an optimal choice for electrical and electronic uses that demand high reliability.

PropertyUnitCharacteristic valueTest conditionsTest method
Upilex®-25SUpilex®-75S
25°C200°C25°C200°C
Dielectric strength kV 6.8 6.8 11 11 50Hz ASTM D149
Dielectric constant - 3.5 3.3 3.3 3.2 1kHz ASTM D150
Dissipation factor - 0.0013 0.0078 0.0038 0.0056 1kHz ASTM D150
Volume resistivity Ωm 1015 1013 1014 1014 DC 100V ASTM D257
Surface resistivity Ω >1017 1015 >1016 1015 DC 100V ASTM D257

3. Thermal Properties

Upilex®-S boasts the highest heat resistance of any plastic film currently available. Its major features include a high starting temperature for thermal decomposition, smaller values of both heat shrinkage and thermal linear expansion coefficients, as well as flame resistance (UL94 VTM-0). Therefore, Upilex®-S varies little in size even when heated. This makes it ideal for use in FPC and TAB-tape substrates composed of minute circuits.

PropertyUnitCharacteristic valueTest condition
(test method)
Upilex®-25SUpilex®-75S
Heat shrinkage % 0.1 0.01 200°C, 2 hours, ASTM D1204
Thermal linear expansion coefficient
(50-200°C)
ppm/K 12 20 Values determined
by minute linear expansion tester at 5°C/min. temperature increments
Melting point °C None  
Specific heat kJ/(kg·K) 1.13 Differential scanning calorimeter
Temperature index °C 290 Heat treatment: 20,000 hours
Non-flammability - UL94VTM-0
(Exceeding 7.5 μm)
UL94 File No. 48133
Oxygen index % 66 JIS K7201
Thermal conductivity W/(m·K) 0.290 Laser flash method

4. Chemical-Resistant Properties

Upilex®-S is insoluble in all organic solvents and is sufficiently resistant to virtually any chemical, including inorganic acid and alkali solution. This chemical resistance provides exceptional physical properties as well as superior dimensional stability when Upilex®-S exposed to chemicals.

PropertyCharacteristic value (Upilex-®-S)Test conditionTest method
Strength retained
(%)
Elongation retained
(%)
Modulus retained
(%)
Resistance to:         ASTM D882
10% sodium hydroxide 80 60 95 Immersion at 25°C
for 5 days
Glacial acetic acid 100 95 100 Immersion at 110°C
for 5 weeks
Water PH=1.0 95 85 100 Immersion at 100°C
for 2 weeks
PH=4.2 95 85 100 Immersion at 100°C
for 2 weeks
PH=8.9 95 85 100 Immersion at 100°C
for 2 weeks
PH=10.0 95 85 100 Immersion at 100°C
for 4 days
Water absorption 1.4% Immersion in water at 23°C
for 24 hours
ASTM D570
0.8% Immersion in
water at 23°C
for 24 hours
Gas permeability      
Water vapor 1.7×10-3kg/m2/25μm 38°C, 90% RH for 24 hours ASTM
E96
Oxygen 0.8×10-6m3/m2/25μm 30°C, 1 atm for 24 hours ASTM D1434
Carbon dioxide 1.2×10-3m3/m2/25μm 30°C, 1 atm for 24 hours ASTM D1434

5. Environmental Resistance

Upilex®-S features low water absorption and hygroscopic expansion. Another advantage inherent in Upilex®-S is its low absorption/desorption speeds. All these combine to delivery high dimensional stability even when moisture is absorbed. It also delivers exceptional weather resistance as shown in the figures below.

General Properties of Various Heat-Resistant Films

PropertyUnitUpilex®-SConventional polyimidePolyesterPolysulfonePolytetra
fluoroethylene
Density g/cm3 1.47 1.42 1.38-1.41 1.24-1.25 2.1-2.2
Tensile strength MPa 520 173 137-245 58-74 11-31
Elongation % 42 70 60-170 60-110 100-400
Tensile modulus MPa 9,120 2,961 - - -
Tear strength-initiation (Graves) N 226 197 177-530 39 -
Tear strength-propagation N 3.24 3.14 4.90-10.79 3.92-4.90 3.92
Resistance to
organic solvents
- Excellent Excellent Excellent Excellent Excellent
Resistance to
strong acids
- Good Good Good Excellent Excellent
Resistance to
strong alkalis
- Good Poor Good Excellent Excellent
Dielectric constant - 3.5 3.5 3.2 3.1 2.1
Dissipation factor - 0.0013 0.003 0.005 0.0008 0.0002

(Modern Plastics Encyclopedia)

Upilex® Grades and Area Factors

PropertyGradeThickness (μm)Width (mm)Area factor (m2/kg)
Upilex®-S
12.5SN 12.5 508/1,016 54.4
25S 25 508/1,016 27.2
50S 50 508/1,016 13.6
75S 75 508/1,016 9.1
125S 125 508/1,016 5.4

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